Hong Kong Stock Market News | ASM Pacific Technology continues to rise by over 5%, with a cumulative increase of over 50% this year. Domestic wafer fabs are expected to accelerate their pace of advanced process expansion
ASM Pacific Technology (ASMPT) surged over 5%, with a cumulative increase of over 50% year-to-date. As of the time of writing, it rose by 4.49% to HKD 111.7, with a turnover of HKD 142 million. Shenwan Hongyuan pointed out that overall, it is expected that domestic technological research and development progress will be accompanied by optimization of the international environment, and the pace of expansion of advanced processes in domestic wafer fabs is expected to accelerate. The demand for advanced processes in AI chips and consumer electronics is strong, with significant room for expansion in domestic wafer fabs for advanced processes. The acquisition of core equipment and the progress of wafer fab manufacturing processes are the most critical factors affecting the speed of expansion. The bank expects that the pace of expansion of advanced processes in domestic wafer fabs will exceed market expectations in the coming years. Guotai Junan released a research report stating that the demand for high computing power driven by AI + digital economy is boosting ASMPT, which comprehensively covers advanced packaging solutions and accelerates the iteration of TCB equipment, poised to benefit significantly. The bank pointed out that the semiconductor advanced packaging industry rebounded in the fourth quarter of 23, with more orders, and the company adjusted its product structure, leading to a quarter-on-quarter increase in gross margin in the fourth quarter. The continuous increase in demand for AI and other applications in 24 is expected to drive further expansion of production lines such as CoWoS, increasing the demand for company equipment
According to the information from the Wise Finance and Economics APP, ASM Pacific Technology (00522) has risen by over 5% again, with a cumulative increase of over 50% this year. As of the time of publication, it has increased by 4.49% to HKD 111.7, with a turnover of HKD 1.42 billion.
Shenwan Hongyuan pointed out that overall, it is expected that the progress of domestic technology research and development will be accompanied by the optimization of the international environment, and the pace of expansion of advanced processes in domestic wafer fabs is expected to accelerate. The demand for advanced processes in AI chips and consumer electronics is strong, and there is a huge space for expansion of advanced processes in domestic wafer fabs. The acquisition of core equipment and the progress of wafer fab manufacturing processes are the most critical factors affecting the speed of expansion. The bank expects that the pace of expansion of advanced processes in domestic wafer fabs is expected to exceed market expectations in the next few years.
Guotai Junan released a research report stating that the combination of AI and the digital economy is driving the demand for high computing power, and ASM Pacific Technology comprehensively covers advanced packaging solutions and accelerates the iteration of TCB equipment, which is expected to benefit significantly. The bank pointed out that the semiconductor advanced packaging industry rebounded in the fourth quarter of 23, with more orders, and the company adjusted its product structure, leading to a quarter-on-quarter increase in gross profit margin in the fourth quarter. The continuous increase in demand for AI and other technologies in 24 is expected to drive further expansion of production lines such as CoWoS, leading to an increase in the company's equipment demand