<p>Taiwan Semiconductor Manufacturing Company's holding subsidiary ESMC will hold a groundbreaking ceremony for a wafer fab in Dresden, Germany on August 20th. The wafer fab will focus on automotive and industrial chips, with specific processes including 28/22nm planar CMOS, 16/12nm FinFET, and other mature processes. Mass production is expected to begin in 2027, with a monthly capacity of up to 40,000 12-inch wafers</p>

<p>Taiwan Semiconductor Manufacturing Company's holding subsidiary ESMC will hold a groundbreaking ceremony for the Dresden wafer fab in Germany on August 20th. The wafer fab will focus on automotive and industrial chips, with specific processes including 28/22nm planar CMOS, 16/12nm FinFET, and other mature processes. Mass production is expected to be achieved in 2027, with a monthly capacity of up to 40,000 12-inch wafers</p>

Taiwan Semiconductor's German wafer fab held a groundbreaking ceremony on August 20th

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